Preliminary electrical characterisation of the fabricated device delivers a displacement of 13.96 μm at an actuation of 100 V AC signal and 10 V DC offset voltage, which is in accordance with the finite element model of the device.
A four-mask CMOS-compatible fabrication process flow is developed to realise the device by optical lithography and controlled deep reactive ion etching (DRIE) of SOI wafers. The device consists of a novel configuration of curved serpentine springs and a set of beam elements serving the dual roles of a comb drive actuator as well as an optical grating.
To demonstrate the process, a MEMS grating device with out-of-plane resonant actuation with potential application in Fourier transform infrared (FTIR) spectroscopy is presented. The extremely sensitive step of dicing the fragile wafer, after fabrication, is included as part of the process flow. Starting clockwise from the top, I tested Trader Joes chili crunch oil, soy sauce, lemon, cooked beet, sriracha, yellow mustard and EVOO. The first pic is the ultrasoft slab and the second pic the silk slab. Release of stress in the buried oxide layer, which affects the fabrication yield, is addressed through modification in the mask design and controlled wet etching process. Yesterday I finally got around to testing my Neolith Calacatta Ultrasoft and Calacatta Silk slabs Neolith Finish Options. Challenges in the fabrication of the device are addressed through innovative design of the mask layout and process flow optimisation.
We report the design and fabrication process optimisation of an optical MEMS device, addressing the various processing difficulties experienced in the fabrication of silicon-on-insulator (SOI)-based devices.
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